Taiwan’s GlobalWafers Expands Global Chip-Making Capacity Amid Fears of Rising Tariffs: CEO Doris Hsu Discusses Strategies and Concerns

GlobalWafers of Taiwan is increasing its chip production capabilities internationally due to concerns about potential tariffs. The company, which ranks as the third largest silicon wafer supplier globally, is extending its operations in the United States and Europe. The firm's CEO, Doris Hsu, has voiced worries about a possible 'special tariff'.

GlobalWafers is intensifying its overseas manufacturing efforts in anticipation of increased chip material tariffs, highlighting the escalating assumption that reciprocal trade actions will upset the semiconductor supply chain in the near future.

The third biggest silicon wafer supplier globally is broadening its production facilities in six out of the nine nations it operates in. This includes two plants in the United States, one in Italy, and one in Denmark.

GlobalWafers' CEO and Chairwoman, Doris Hsu, expressed to Bloomberg Television her expectation that unique industry tariffs will be implemented not just in the US, but in other nations as well. She suggested that these potential tariffs could be circumvented by transitioning to domestic production.

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TSMC, the world's biggest contract chip manufacturer, officially opens its first facility in Japan.

Worldwide, governments are beginning to perceive semiconductor technology as a matter of national safety due to the chip shortages experienced amid and post the Covid-19 crisis, which severely impacted several sectors, notably the automobile industry. Heightened geopolitical conflicts have further intensified the situation.